MT29F128G08AJAAAWP-Z:A 详细参数介绍:
脚位/封装 | TSOP-48 |
外包装 | |
无铅/环保 | 无铅/环保 |
电压(伏) | 2.7v-3.6v |
温度规格 | 0°C~+70°C |
速度 | 1 MHZ |
标准包装数量 | |
标准外箱 | |
Number Of Words | 16G |
Bit Organization | x8 |
Density | 128G |
Features | Polyimide (if applicable) |
Package | TSOP I(48-pin CPL version) |
Generation Feature Set | 1st set of device features |
Speed Grade | Async only |
Design Revision | A |
Classification | 4-2-2-1 (Die-nCE-RnB-IO Channels) |
Level | SLC |
Production Status | Production |
Package Material | Pb-free |
Interface | Async only |
General Description Micron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These devices use a highly multiplexed 8-bit bus (DQx) to transfer commands, address, and data. There are five control signals used to implement the asynchronous data interface: CE#, CLE, ALE, WE#, and RE#. Additional signals control hardware write protection (WP#) and monitor device status (R/B#). This Micron NAND Flash device additionally includes a synchronous data interface for high-performance I/O operations. When the synchronous interface is active, WE# becomes CLK and RE# becomes W/R#. Data transfers include a bidirectional data strobe (DQS). This hardware interface creates a low pin-count device with a standard pinout that remains the same from one density to another, enabling future upgrades to higher densities with no board redesign. A target is the unit of memory accessed by a chip enable signal. A target contains one or more NAND Flash die. A NAND Flash die is the minimum unit that can independently execute commands and report status. A NAND Flash die, in the ONFI specification, is referred to as a logical unit (LUN). For further details, see Device and Array Organization.
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