MT29C4G96MAZBACKD-5 WT 详细参数介绍:
脚位/封装 | VFBGA |
外包装 | |
无铅/环保 | 无铅/环保 |
电压(伏) | 1.8 V |
温度规格 | -35°C~+85°C |
速度 | |
标准包装数量 | |
标准外箱 |
General Description Micron package-on-package (PoP) MCP products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with lowpower, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices are also members of the Micron discrete memory products portfolio. The NAND Flash and Mobile LPDRAM devices are packaged with separate interfaces (no shared address, control, data, or power balls). This bus architecture supports an optimized interface to processors with separate NAND Flash and Mobile LPDRAM buses. The NAND Flash and Mobile LPDRAM devices have separate core power connections and share a common ground (that is, VSS is tied together on the two devices). The bus architecture of this device also supports separate NAND Flash and Mobile LPDRAM functionality without concern for device interaction.
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